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Text excerpt from page 65 (click to view)
KX-TG9348T/KX-TGA931T/KX-TGA936B
10.3. How to Replace the LLP (Leadless Leadframe Package) IC
10.3.1. Preparation
� PbF (: Pb free) Solder � Soldering Iron Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. � Hot Air Desoldering Tool Temperature: 608 °F ± 68 °F (320 °C ± 20 °C)
10.3.2. Caution
� To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package. � Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
10.3.3. How to Remove the Shield Case
Note: If you don�t have special tools (ex. Hot air disordering tool), conduct the following operations. 1. Cut the case along perforation.
